標題: PACKAGE STRUCTURE OF A LIGHT-EMITTING DEVICE
作者: Chien-Chung Lin
Hao-Chung Kuo
Chin-Wei Sher
Hau-Vei Han
Kuo-Ju Chen
Zong-Yi Tu
Hsien-Hao Tu
公開日期: 9-二月-2017
摘要: A light-emitting device packaging structure is provided. The light-emitting device packaging structure includes a substrate, an array of light-emitting devices, an encapsulating layer, scattering particles, and a fluorescent material layer. The array of light-emitting devices is on the substrate. The encapsulating layer covers the array of light-emitting devices. The scattering particles are dispersed in the encapsulating layer. The fluorescent material layer is on the encapsulating layer.
官方說明文件#: H01L023/535
H01L021/768
H01L023/532
URI: http://hdl.handle.net/11536/151251
專利國: USA
專利號碼: 20170040262
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