| 標題: | PACKAGE STRUCTURE OF A LIGHT-EMITTING DEVICE |
| 作者: | Chien-Chung Lin Hao-Chung Kuo Chin-Wei Sher Hau-Vei Han Kuo-Ju Chen Zong-Yi Tu Hsien-Hao Tu |
| 公開日期: | 9-Feb-2017 |
| 摘要: | A light-emitting device packaging structure is provided. The light-emitting device packaging structure includes a substrate, an array of light-emitting devices, an encapsulating layer, scattering particles, and a fluorescent material layer. The array of light-emitting devices is on the substrate. The encapsulating layer covers the array of light-emitting devices. The scattering particles are dispersed in the encapsulating layer. The fluorescent material layer is on the encapsulating layer. |
| 官方說明文件#: | H01L023/535 H01L021/768 H01L023/532 |
| URI: | http://hdl.handle.net/11536/151251 |
| 專利國: | USA |
| 專利號碼: | 20170040262 |
| Appears in Collections: | Patents |
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