標題: METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
作者: Chao-Hsin CHIEN
Chi-Wen LIU
Chung-Chun HSU
Wei-Chun CHI
公開日期: 1-Mar-2018
摘要: A method of manufacturing a semiconductor device includes forming a first metal layer on a semiconductor substrate and forming a second metal layer on the first metal layer. The second metal layer is formed of a different metal than the first metal layer. Microwave radiation is applied to the semiconductor substrate, first metal layer, and second metal layer to form an alloy comprising components of the first metal layer, second metal layer, and the semiconductor substrate.
官方說明文件#: H01L021/24
H01L021/285
H01L029/47
H01L029/872
H01L029/66
URI: http://hdl.handle.net/11536/151419
專利國: USA
專利號碼: 20180061642
Appears in Collections:Patents


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