Title: METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
Authors: Chao-Hsin CHIEN
Chi-Wen LIU
Chung-Chun HSU
Wei-Chun CHI
Issue Date: 1-Mar-2018
Abstract: A method of manufacturing a semiconductor device includes forming a first metal layer on a semiconductor substrate and forming a second metal layer on the first metal layer. The second metal layer is formed of a different metal than the first metal layer. Microwave radiation is applied to the semiconductor substrate, first metal layer, and second metal layer to form an alloy comprising components of the first metal layer, second metal layer, and the semiconductor substrate.
Gov't Doc #: H01L021/24
H01L021/285
H01L029/47
H01L029/872
H01L029/66
URI: http://hdl.handle.net/11536/151419
Patent Country: USA
Patent Number: 20180061642
Appears in Collections:Patents


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