標題: | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE |
作者: | Chao-Hsin CHIEN Chi-Wen LIU Chung-Chun HSU Wei-Chun CHI |
公開日期: | 1-三月-2018 |
摘要: | A method of manufacturing a semiconductor device includes forming a first metal layer on a semiconductor substrate and forming a second metal layer on the first metal layer. The second metal layer is formed of a different metal than the first metal layer. Microwave radiation is applied to the semiconductor substrate, first metal layer, and second metal layer to form an alloy comprising components of the first metal layer, second metal layer, and the semiconductor substrate. |
官方說明文件#: | H01L021/24 H01L021/285 H01L029/47 H01L029/872 H01L029/66 |
URI: | http://hdl.handle.net/11536/151419 |
專利國: | USA |
專利號碼: | 20180061642 |
顯示於類別: | 專利資料 |