完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Tsan-Wen Lu | en_US |
dc.contributor.author | Chun Wang | en_US |
dc.contributor.author | Po-Tsung Lee | en_US |
dc.date.accessioned | 2019-04-11T06:06:35Z | - |
dc.date.available | 2019-04-11T06:06:35Z | - |
dc.date.issued | 2018-04-05 | en_US |
dc.identifier.govdoc | G01L007/02 | en_US |
dc.identifier.govdoc | H01L031/16 | en_US |
dc.identifier.govdoc | H01L031/0232 | en_US |
dc.identifier.govdoc | H01S005/00 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/151421 | - |
dc.description.abstract | A pressure sensing device including a light source, at least one resonant structure, a cladding body, a first substrate and a second substrate is provided. The light source is configured to provide an original broadband light. The resonant structure includes a plurality of semiconductor rod structures arranged into a row at intervals along a single arranging direction, and each of the semiconductor rod structures has a lattice constant on the arranging direction. The original broadband light is transmitted between the semiconductor rod structures, and a resonant light is produced, wherein each of the semiconductor rod structures has a length perpendicular to the arranging direction and has a width parallel to the arranging direction, the length and the width are less than the wavelength of the resonant light. The cladding body completely covers the semiconductor rod structures of the at least one resonant structure. The cladding body and the at least one resonant structure are interposed between the first substrate and the second substrate. When a pressure is applied on at least one of the first substrate and the second substrate, the pressure is transmitted to the cladding body along a direction perpendicular to the arranging direction, a deformation corresponding to the pressure is occurred on the cladding body and the semiconductor rod structures on the arranging direction, and a wavelength of the resonant light is changed according to the deformation. Besides, a pressure sensing apparatus is also provided. | en_US |
dc.language.iso | en_US | en_US |
dc.title | PRESSURE SENSING DEVICE AND PRESSURE SENSING APPARATUS | en_US |
dc.type | Patents | en_US |
dc.citation.patentcountry | USA | en_US |
dc.citation.patentnumber | 20180094995 | en_US |
顯示於類別: | 專利資料 |