標題: Ultra-High Light Extraction Efficiency and Ultra-Thin Mini-LED Solution by Freeform Surface Chip Scale Package Array
作者: Huang, Che-Hsuan
Kang, Chieh-Yu
Chang, Shu-Hsiu
Lin, Chih-Hao
Lin, Chun-Yu
Wu, Tingzhu
Sher, Chin-Wei
Lin, Chien-Chung
Lee, Po-Tsung
Kuo, Hao-Chung
光電系統研究所
電機學院
光電工程學系
Institute of Photonic System
College of Electrical and Computer Engineering
Department of Photonics
關鍵字: chip scale package;freeform design;mini LED;light emitting diode
公開日期: 1-Apr-2019
摘要: In this study, we present a novel type of package, freeform-designed chip scale package (FDCSP), which has ultra-high light extraction efficiency and bat-wing light field. For the backlight application, mainstream solutions are chip-scale package (CSP) and surface-mount device package (SMD). Comparing with these two mainstream types of package, the light extraction efficiency of CSP, SMD, and FDCSP are 88%, 60%, and 96%, respectively. In addition to ultra-high light extraction efficiency, because of the 160-degree bat-wing light field, FDCSP could provide a thinner and low power consumption mini-LED solution with a smaller number of LEDs than CSP and SMD light source array.
URI: http://dx.doi.org/10.3390/cryst9040202
http://hdl.handle.net/11536/151966
ISSN: 2073-4352
DOI: 10.3390/cryst9040202
期刊: CRYSTALS
Volume: 9
Issue: 4
起始頁: 0
結束頁: 0
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