标题: | Low temperature bonding technology for 3D integration |
作者: | Ko, Cheng-Ta Chen, Kuan-Neng 电子工程学系及电子研究所 Department of Electronics Engineering and Institute of Electronics |
公开日期: | 1-二月-2012 |
摘要: | 3D integration provides a promising solution to achieve system level integration with high function density, small form factor, enhanced transmission speed and low power consumption. Stacked bonding is the key technology to enable the communication between different strata of the 3D integration system. Low temperature bonding approaches are explored in industry to solve the performance degradation issue of the integrated devices. In this paper, various low temperature bonding technologies are reviewed and introduced, as well as the latest developments in world-wide companies and research institutes. The outlook for industrial application is also addressed in the paper. (C) 2011 Elsevier Ltd. All rights reserved. |
URI: | http://dx.doi.org/10.1016/j.microrel.2011.03.038 http://hdl.handle.net/11536/15218 |
ISSN: | 0026-2714 |
DOI: | 10.1016/j.microrel.2011.03.038 |
期刊: | MICROELECTRONICS RELIABILITY |
Volume: | 52 |
Issue: | 2 |
起始页: | 302 |
结束页: | 311 |
显示于类别: | Articles |
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