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dc.contributor.authorLin, T. W.en_US
dc.contributor.authorKu, S. H.en_US
dc.contributor.authorCheng, C. H.en_US
dc.contributor.authorLee, C. W.en_US
dc.contributor.authorIjen-Huangen_US
dc.contributor.authorTsai, Wen-Jeren_US
dc.contributor.authorLu, T. C.en_US
dc.contributor.authorLu, W. P.en_US
dc.contributor.authorChen, K. C.en_US
dc.contributor.authorWang, Tahuien_US
dc.contributor.authorLu, Chih-Yuanen_US
dc.date.accessioned2019-08-02T02:24:17Z-
dc.date.available2019-08-02T02:24:17Z-
dc.date.issued2018-01-01en_US
dc.identifier.isbn978-1-5386-5479-8en_US
dc.identifier.issn1541-7026en_US
dc.identifier.urihttp://hdl.handle.net/11536/152442-
dc.description.abstractVt instability caused by random telegraph noise (RTN) in floating gate flash memories beyond 20nm is studied comprehensively. Experiments reveal that the RTN would cause Vt distribution with a kinked tail which re-distributes to a "Gaussian-like" shape rapidly and was measured by the self established Budget Product Tester (BPT). A Multi-Times Verify (MTV) algorithm to mitigate the statistical tail, thus enlarging operation window is also exhibited by BPT. In further, a probability model to portray the compact Vt distribution under MTV is proposed. Finally, the impact of MTV on lowering the requirement of Error-correcting code (ECC) bit is also demonstrated.en_US
dc.language.isoen_USen_US
dc.titleChip-Level Characterization and RTN-Induced Error Mitigation beyond 20nm Floating Gate Flash Memoryen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2018 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)en_US
dc.citation.spage0en_US
dc.citation.epage0en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000468959600140en_US
dc.citation.woscount0en_US
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