标题: Copper direct bonding with short time and excellent electrical property by < 111 >-oriented nano-twinned copper
作者: Shie, Kai Cheng
Juang, Jing-Ye
Chen, Chih
材料科学与工程学系
Department of Materials Science and Engineering
公开日期: 1-一月-2019
摘要: In order to be compatible with semiconductor manufacturing, nanotwinned Cu microbumps were fabricated on 8 '' wafers. The pair of top and bottom dies were jointed through thermal compression bonding. After 1 min bonding time, the resistance could obtaine from all test structures, which indicates all the microbumps were bonded in the short time successfully.
URI: http://hdl.handle.net/11536/153259
ISBN: 978-4-904743-07-2
期刊: PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D)
起始页: 50
结束页: 50
显示于类别:Conferences Paper