標題: Utilization of low-melting temperature alloy with confined seal for reducing thermal contact resistance
作者: Chu, Wen-Xiao
Tseng, Po-Hsiang
Wang, Chi-Chuan
機械工程學系
Department of Mechanical Engineering
關鍵字: Low-melting temperature alloy;Thermal contact resistance;Metal seal;Thermal cycle
公開日期: 25-十二月-2019
摘要: This paper investigates a novel design of thermal interface material (TIM) using low-melting temperature alloy (LMTA) with confined seal. For solid TIM like indium foil, the thermal contact resistance is reduced with the rise with contact pressure, and an apparent hysteresis phenomenon may occur during loading/unloading of contact pressure. For the solid-state TIM, the indium TIM outperforms those of copper, lead and tin TIMs. The molten LMTA can further reduce the thermal contact resistance, however, the overflow and dislocation problems are observed. Hence, a novel confined design by using LMTA with an annular metal seal is proposed that can completely prevent aforementioned problems. Yet the reliability of the novel TIM is also investigated after hundred thermal cycles.
URI: http://dx.doi.org/10.1016/j.applthermaleng.2019.114438
http://hdl.handle.net/11536/153406
ISSN: 1359-4311
DOI: 10.1016/j.applthermaleng.2019.114438
期刊: APPLIED THERMAL ENGINEERING
Volume: 163
起始頁: 0
結束頁: 0
顯示於類別:期刊論文