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dc.contributor.authorLin, Wei-Liangen_US
dc.contributor.authorTsai, Wen-Jeren_US
dc.contributor.authorCheng, C. C.en_US
dc.contributor.authorLu, Chun-Changen_US
dc.contributor.authorKu, S. H.en_US
dc.contributor.authorChang, Y. W.en_US
dc.contributor.authorWu, Guan-Weien_US
dc.contributor.authorLiu, Lenvisen_US
dc.contributor.authorHwang, S. W.en_US
dc.contributor.authorLu, Tao-Chengen_US
dc.contributor.authorChen, Kuang-Chaoen_US
dc.contributor.authorTseng, Tseung-Yuenen_US
dc.contributor.authorLu, Chih-Yuanen_US
dc.date.accessioned2020-02-02T23:55:33Z-
dc.date.available2020-02-02T23:55:33Z-
dc.date.issued2019-01-01en_US
dc.identifier.isbn978-1-7281-0942-8en_US
dc.identifier.issn1930-8868en_US
dc.identifier.urihttp://hdl.handle.net/11536/153665-
dc.description.abstractWe investigate a hot-carrier injection- induced program disturb in a 3D NAND flash memory. As there exist specific coding patterns, a "down-coupling" region and a "pre-charge" regions are formed during program-verify and the following program phases, respectively, in the inhibit cell strings. A high heating field is built nearby the PGM wordline. Hot carriers may inject into the inhibit cells as Vpgm is applied. Soft ramp-down and pre-turn-on schemes are proposed to mitigate this disturb.en_US
dc.language.isoen_USen_US
dc.titleHot-Carrier Injection-Induced Disturb and Improvement Methods in 3D NAND Flash Memoryen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2019 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA)en_US
dc.citation.spage0en_US
dc.citation.epage0en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000503374900012en_US
dc.citation.woscount0en_US
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