標題: | Phone-nomenon: A System-Level Thermal Simulator for Handheld Devices |
作者: | Chiou, Hong-Wen Lee, Yu-Min Shiau, Shin-Yu Pan, Chi-Wen Chen, Tai-Yu 交大名義發表 電信工程研究所 National Chiao Tung University Institute of Communications Engineering |
公開日期: | 1-一月-2019 |
摘要: | This work presents a system-level thermal simulator, Phone-nomenon, to predict the thermal behavior of smartphone. First, we study the nonlinearity of internal and external heat transfer mechanisms and propose a compact thermal model. After that, we develop an iterative framework to handle the nonlinearity. Compared with a commercial tool, ANSYS Icepak, Phonenomenon can achieve two and three orders of magnitude speedup with 3:58% maximum error and 1:72 degrees C di fference for steady-state and transient-state simulations, respectively. Meanwhile, Phone-nomenon also fits the measured data of a built thermal test vehicle pretty well. |
URI: | http://dx.doi.org/10.1145/3287624.3287632 http://hdl.handle.net/11536/153678 |
ISBN: | 978-1-4503-6007-4 |
DOI: | 10.1145/3287624.3287632 |
期刊: | 24TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC 2019) |
起始頁: | 538 |
結束頁: | 543 |
顯示於類別: | 會議論文 |