完整後設資料紀錄
DC 欄位語言
dc.contributor.authorHung, Chia-Lungen_US
dc.contributor.authorTsui, Bing-Yueen_US
dc.date.accessioned2020-05-05T00:02:19Z-
dc.date.available2020-05-05T00:02:19Z-
dc.date.issued2020-04-01en_US
dc.identifier.issn0038-1101en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.sse.2020.107774en_US
dc.identifier.urihttp://hdl.handle.net/11536/154128-
dc.description.abstractSiC devices are suitable for high temperature applications due to its' wide energy bandgap and high thermal conductivity. Some SiC CMOSFET ICs have been reported recently. However, less literature address the characteristics of SiC PMOSFET. In this work, we fabricated PMOSFET with Local Oxidation of SiC (LOCOSiC) isolation structure and different gate oxidation processes targeting sub-10V operation. Well behaved PMOSFET with suitable threshold voltage ( - 5.58 V), low subthreshold swing (200 mV/decade), acceptable hole mobility (3 cm(2)/V-sec), and low off-state current ( < 1 x 10(-12) A/mu m at -10 V) is achieved. Temperature dependence of device characteristics are investigated. These results make the implementation of high-performance CMOS a great progress.en_US
dc.language.isoen_USen_US
dc.subjectSilicon carbideen_US
dc.subjectMetal-oxide-semiconductor field effect transistoren_US
dc.subjectGate oxideen_US
dc.subjectIsolationen_US
dc.titleWell-behaved 4H-SiC PMOSFET with LOCal oxidation of SiC (LOCOSiC) isolation structure and compromised gate oxide for Sub-10V SiC CMOS applicationen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.sse.2020.107774en_US
dc.identifier.journalSOLID-STATE ELECTRONICSen_US
dc.citation.volume166en_US
dc.citation.spage0en_US
dc.citation.epage0en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000519585500009en_US
dc.citation.woscount0en_US
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