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dc.contributor.authorHsieh, Chih-Renen_US
dc.contributor.authorChen, Yung-Yuen_US
dc.contributor.authorLin, Wen-Shinen_US
dc.contributor.authorLin, Grayen_US
dc.contributor.authorLou, Jen-Chungen_US
dc.date.accessioned2014-12-08T15:21:42Z-
dc.date.available2014-12-08T15:21:42Z-
dc.date.issued2011en_US
dc.identifier.isbn978-1-60768-213-4en_US
dc.identifier.issn1938-5862en_US
dc.identifier.urihttp://hdl.handle.net/11536/15431-
dc.identifier.urihttp://dx.doi.org/10.1149/1.3568868en_US
dc.description.abstractThe improved data retention characteristics of Polysilicon-oxide-hafnium oxide-oxide-silicon (SOHOS) type nonvolatile memory were obtained by post-HfO2 trapping layer deposition tetrafluoromethane (CF4) plasma treatment. The memory characteristics such as program/erase speed, retention and endurance were studied comprehensively. That fluorine atoms incorporated into Hf-based high-k material eliminate shallow trap defect level effectively and remain deeper trap level. Although the shallow traps of the HfOF trapping layer SOHOS memory have passivated, it doesn't deteriorate the program/erase speed obviously and retention characteristic was then improved because of deeper electron storage level. The results clearly indicate CF4 plasma treatment-induced deep electron storage level is a feasible technology for future SOHOS-type nonvolatile flash memory application.en_US
dc.language.isoen_USen_US
dc.titleEnhanced data retention characteristic on SOHOS-type nonvolatile flash memory with CF4-plasma-induced deep electron trap levelen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1149/1.3568868en_US
dc.identifier.journalSILICON COMPATIBLE MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED INTEGRATED CIRCUITS AND EMERGING APPLICATIONSen_US
dc.citation.volume35en_US
dc.citation.issue2en_US
dc.citation.spage257en_US
dc.citation.epage263en_US
dc.contributor.department電機工程學系zh_TW
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000301040100027-
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