標題: Tensile Properties of < 111 >-Oriented Nanotwinned Cu with Different Columnar Grain Structures
作者: Li, Yu-Jin
Tu, King-Ning
Chen, Chih
材料科學與工程學系
國際半導體學院
Department of Materials Science and Engineering
International College of Semiconductor Technology
關鍵字: nano-twinned Cu;tensile properties;grain microstructures
公開日期: 2-三月-2020
摘要: We performed tensile tests on highly <111>-oriented nanotwinned copper (nt-Cu) foils with different columnar grain structures. For a systematic study, we altered the microstructure of the foils by tuning the electroplating electrolyte and annealing temperatures under a nitrogen atmosphere. The results show that the yield strength ranges from 300 to 700 MPa, and elongation spans from 5% to 25%. Knowing the measured twin spacing and average grain size, and combining the confined layer slip with the Hall-Petch equation, we calculated the theoretical yield strength of the nt-Cu with different microstructures, and the theoretic values match the experiment results. Owing to the unique crystal orientation properties of <111>-oriented columnar grains, dislocations induced by slip are very limited. The Schmid factor of grains along the tensile axis direction is highly identical, so the plastic deformation is much more suitably explained by the Schmid factor model. Thus, we replace the Taylor factor with the Schmid factor in the slip model of nt-Cu.
URI: http://dx.doi.org/10.3390/ma13061310
http://hdl.handle.net/11536/154453
DOI: 10.3390/ma13061310
期刊: MATERIALS
Volume: 13
Issue: 6
起始頁: 0
結束頁: 0
顯示於類別:期刊論文