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dc.contributor.authorLee, Weien_US
dc.contributor.authorKuo, Jack J. -Y.en_US
dc.contributor.authorChen, Willian P. -N.en_US
dc.contributor.authorSu, Pinen_US
dc.contributor.authorJeng, Min-Chieen_US
dc.date.accessioned2014-12-08T15:21:55Z-
dc.date.available2014-12-08T15:21:55Z-
dc.date.issued2009en_US
dc.identifier.isbn978-4-86348-009-4en_US
dc.identifier.urihttp://hdl.handle.net/11536/15609-
dc.description.abstractUsing an improved temperature-dependent method, this paper clarifies that channel backscattering of nanoscale PMOSFETs can be reduced by the uniaxially compressive strain. For the first time, the electrostatic potential of the source-channel junction barrier has been experimentally characterized with strain and gate voltage dependence. We further demonstrate that the strain technology can improve the drain current variation as well as the mismatching properties through the enhanced ballistic efficiency. Moreover, the improvement shows gate length and drain voltage dependence.en_US
dc.language.isoen_USen_US
dc.titleImpact of Uniaxial Strain on Channel Backscattering Characteristics and Drain Current Variation for Nanoscale PMOSFETsen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2009 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERSen_US
dc.citation.spage112en_US
dc.citation.epage113en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000275651200043-
Appears in Collections:Conferences Paper