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dc.contributor.authorChou, Kun-Ien_US
dc.contributor.authorCheng, Chun-Huen_US
dc.contributor.authorChen, Po-Chunen_US
dc.contributor.authorYeh, Fon-Shanen_US
dc.contributor.authorChin, Alberten_US
dc.date.accessioned2014-12-08T15:22:12Z-
dc.date.available2014-12-08T15:22:12Z-
dc.date.issued2011-12-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.50.121801en_US
dc.identifier.urihttp://hdl.handle.net/11536/15717-
dc.description.abstractIn this study we propose a resistive random-access memory (RRAM) using stacked GeOx and PbZr0.5Ti0.5O3 (PZT). Under unipolar-mode operation, the bilayers Ni/GeOx/PZT/TaN RRAM shows a large resistance window of >10(2), for 85 degrees C retention, and a good DC cycling of 2000 cycles, which are significantly better than those shown by the single-layer Ni/PZT/TaN RRAM without the covalent-bond-dielectric GeOx. (C) 2011 The Japan Society of Applied Physicsen_US
dc.language.isoen_USen_US
dc.titleUnipolar Ni/GeOx/PbZr0.5Ti0.5O3/TaN Resistive Switching Memoryen_US
dc.typeArticleen_US
dc.identifier.doi10.1143/JJAP.50.121801en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume50en_US
dc.citation.issue12en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000300707400024-
dc.citation.woscount1-
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