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dc.contributor.authorChen, Min-Chengen_US
dc.contributor.authorLin, Chia-Yien_US
dc.contributor.authorChen, Bo-Yuanen_US
dc.contributor.authorLin, Chang-Hsienen_US
dc.contributor.authorHuang, Guo-Weien_US
dc.contributor.authorHo, Chia-Huaen_US
dc.contributor.authorWang, Tahuien_US
dc.contributor.authorHu, Chenmingen_US
dc.contributor.authorYang, Fu-Liangen_US
dc.date.accessioned2014-12-08T15:22:46Z-
dc.date.available2014-12-08T15:22:46Z-
dc.date.issued2012-04-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://hdl.handle.net/11536/16086-
dc.description.abstractThe behavior of random telegraph noise was affected by nickel silicide barrier height engineering in advanced nano-CMOS technologies. Contact resistance fluctuations with magnitude of up to 40% were observed when a Schottky barrier was reduced to 0.2 eV. The large contact resistance instability is attributed to the barrier modification by positive charge trapping and detrapping in a Schottky contact. The prevalence and magnitude of the noise are dependent on the contact area, trap density, trap energy, and the silicide Schottky barrier height. In this letter, we propose a fast method to extract the density of responsible contact traps.en_US
dc.language.isoen_USen_US
dc.subjectContact resistanceen_US
dc.subjectPoisson distributionen_US
dc.subjectrandom telegraph noise (RTN)en_US
dc.subjectsilicide-process-induced trapsen_US
dc.titleRandom Telegraph Noise in 1X-nm CMOS Silicide Contacts and a Method to Extract Trap Densityen_US
dc.typeArticleen_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume33en_US
dc.citation.issue4en_US
dc.citation.epage591en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000302232900042-
dc.citation.woscount0-
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