Optima Design of Contact Opening for Relieving Current Crowding Effect in Flip-Chip Solder Joints

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Liang, S. W.	en_US
dc.contributor.author	Chen, Chih	en_US
dc.date.accessioned	2014-12-08T15:23:02Z	-
dc.date.available	2014-12-08T15:23:02Z	-
dc.date.issued	2009	en_US
dc.identifier.isbn	978-1-4244-4159-4	en_US
dc.identifier.uri	http://hdl.handle.net/11536/16193	-
dc.description.abstract	The Simulation results show that larger contact opening may not benefit on relieving current crowding effect in the nip-chip solder joints. For the solder Joints with a 10-mu m thick Cu UBM, the diameter of the contact opening for the lowest Current crowding effect is 60 mu m. It means that using larger or smaller diameter will increase the current density in the solder bumps. In addition, the optima diameter of the contact opening with a thin-film UBM is larger than that with a thick UBM. In this letter, the optimal design rule of contact opening for relieving Current crowding effect in solder joints will be provided.	en_US
dc.language.iso	en_US	en_US
dc.title	Optima Design of Contact Opening for Relieving Current Crowding Effect in Flip-Chip Solder Joints	en_US
dc.type	Proceedings Paper	en_US
dc.identifier.journal	EUROSIME 2009: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS	en_US
dc.citation.spage	703	en_US
dc.citation.epage	705	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000268178200105	-
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