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dc.contributor.authorYANG, CKen_US
dc.contributor.authorLEI, TFen_US
dc.contributor.authorLEE, CLen_US
dc.date.accessioned2014-12-08T15:03:03Z-
dc.date.available2014-12-08T15:03:03Z-
dc.date.issued1995-12-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/16.477775en_US
dc.identifier.urihttp://hdl.handle.net/11536/1636-
dc.description.abstractThe electrical characteristics of top-gate thin-film transistors (TFT's) fabricated on the nitrogen-implanted polysilicon of the doses ranging from 2 x 10(12)-2 x 10(14) ions/cm(2) were investigated in this work, The experimental results showed that nitrogen implanted into polysilicon followed by an 850 degrees C 1 h annealing step had some passivation effect and this effect was much enhanced by a following H-2-plasma treatment. The threshold voltages, subthreshold swings, ON-OFF current ratios, and field effect mobilities of both n-channel and p-channel TFT's were all improved, Moreover, the hot-carrier reliability was also improved, A donor effect of the nitrogen in polysilicon was also found which affected the overall passivation effect on the p-channel TFT's.en_US
dc.language.isoen_USen_US
dc.titleCHARACTERISTICS OF TOP-GATE THIN-FILM TRANSISTORS FABRICATED ON NITROGEN-IMPLANTED POLYSILICON FILMSen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/16.477775en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume42en_US
dc.citation.issue12en_US
dc.citation.spage2163en_US
dc.citation.epage2169en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1995TH17200019-
dc.citation.woscount10-
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