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dc.contributor.authorChen, Yu-Chungen_US
dc.contributor.authorHsiao, Feng-Chingen_US
dc.contributor.authorLin, Bo-Wenen_US
dc.contributor.authorWang, Bau-Mingen_US
dc.contributor.authorWu, YewChung Sermonen_US
dc.contributor.authorHsu, Wen-Chingen_US
dc.date.accessioned2014-12-08T15:23:23Z-
dc.date.available2014-12-08T15:23:23Z-
dc.date.issued2012en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/16379-
dc.description.abstractA two-step chemical wet etching processes were used to investigated the formation and the plane indexes of exposed etched facets of wet etching patterned sapphire substrate (PSS). It was found when SiO2 mask still remained on the top c-plane, the structure of PSS comprised of a hexagonal pyramid covered with six facets {3 (4) over bar 17} with a flat top c-plane. When SiO2 mask were etched away, beside six facets on the bottom, there were 3 extra facets {1 (1) over bar 05} exposed on the top. (C) 2012 The Electrochemical Society. [DOI: 10.1149/2.095206jes] All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleThe Formation and the Plane Indices of Etched Facets of Wet Etching Patterned Sapphire Substrateen_US
dc.typeArticleen_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume159en_US
dc.citation.issue6en_US
dc.citation.epageD362en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000304140700051-
dc.citation.woscount8-
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