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dc.contributor.authorWu, Tian-Lien_US
dc.contributor.authorHuang, Chih-Fangen_US
dc.contributor.authorCheng, Chun-Huen_US
dc.date.accessioned2014-12-08T15:23:24Z-
dc.date.available2014-12-08T15:23:24Z-
dc.date.issued2011en_US
dc.identifier.isbn978-1-60768-217-2en_US
dc.identifier.issn1938-5862en_US
dc.identifier.urihttp://hdl.handle.net/11536/16395-
dc.description.abstractThis study has provided considerable insight into the impact of device down scaling on the characteristics of RF devices. This type of RF devices, featuring a thin p-layer based on a semi-insulating substrate, is free from the unwanted parasitic effects resulting from traditional conducting substrates. We fabricated 4H-SiC RF MOSFETs with f(T)/f(MAX) of 0.7/1.5 GHz and, in so doing, identified the key issues associated with short channel effects, influencing device mobility and the RF characteristics of RF MOSFETs on a semi-insulating substrate.en_US
dc.language.isoen_USen_US
dc.titleCharacteristics of 4H-SiC RF MOSFETs on a Semi-insulating Substrateen_US
dc.typeProceedings Paperen_US
dc.identifier.journalWIDE BANDGAP SEMICONDUCTOR MATERIALS AND DEVICES 12en_US
dc.citation.volume35en_US
dc.citation.issue6en_US
dc.citation.epage173en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000305936300020-
Appears in Collections:Conferences Paper


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