Joule heating effect under accelerated electromigration in flip-chip solder joints

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DC Field	Value	Language
dc.contributor.author	Chiu, S. H.	en_US
dc.contributor.author	Liang, S. W.	en_US
dc.contributor.author	Chen, Chili	en_US
dc.contributor.author	Yao, D. J.	en_US
dc.date.accessioned	2014-12-08T15:24:57Z	-
dc.date.available	2014-12-08T15:24:57Z	-
dc.date.issued	2006	en_US
dc.identifier.isbn	1-4244-0151-8	en_US
dc.identifier.issn	0569-5503	en_US
dc.identifier.uri	http://hdl.handle.net/11536/17333	-
dc.identifier.uri	http://dx.doi.org/10.1109/ECTC.2006.1645721	en_US
dc.description.abstract	This study employs three-dimensional simulation to investigate the Joule heating effect under accelerated electromigration tests in flip-chip solder joints. It was found that the Joule heating effect was very seriously during high current stressing, and a hot spot exists in the solder bump. The hot-spot may play important role in the void formation and thermomigration in solder bumps during electromigration.	en_US
dc.language.iso	en_US	en_US
dc.title	Joule heating effect under accelerated electromigration in flip-chip solder joints	en_US
dc.type	Proceedings Paper	en_US
dc.identifier.doi	10.1109/ECTC.2006.1645721	en_US
dc.identifier.journal	56th Electronic Components & Technology Conference 2006, Vol 1 and 2, Proceedings	en_US
dc.citation.spage	663	en_US
dc.citation.epage	666	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000238566600104	-
Appears in Collections:	Conferences Paper

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