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dc.contributor.authorChiang, KCen_US
dc.contributor.authorChin, Aen_US
dc.contributor.authorLai, CHen_US
dc.contributor.authorChen, WJen_US
dc.contributor.authorCheng, CFen_US
dc.contributor.authorHung, BFen_US
dc.contributor.authorLiao, CCen_US
dc.date.accessioned2014-12-08T15:25:27Z-
dc.date.available2014-12-08T15:25:27Z-
dc.date.issued2005en_US
dc.identifier.isbn4-900784-00-1en_US
dc.identifier.urihttp://hdl.handle.net/11536/17833-
dc.description.abstractFor the first time, high density (10.3 fF/mu m(2)), low voltage linearity (alpha = 89 ppm/V-2) and small leakage current (1.2 x 10(-8) A/cm(2) or 5.8 fA/[pF circle V] at 2V) meet all the ITRS requirements of analog capacitor at year 2018. These are achieved by novel high-kappa TiTaO (kappa = 45) and high work-function Ir capacitor, which further improve to very high 23 fF/mu m(2) density and low 81 ppm/V-2 linearity for higher speed analog/RF ICs at 1 GHz, using the fast a decay mechanism with increasing frequency.en_US
dc.language.isoen_USen_US
dc.titleVery high kappa and high density TiTaO MIM capacitors for analog and RF applicationsen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2005 Symposium on VLSI Technology, Digest of Technical Papersen_US
dc.citation.spage62en_US
dc.citation.epage63en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000234973100024-
Appears in Collections:Conferences Paper