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dc.contributor.authorMeng, C. C.en_US
dc.contributor.authorSu, J. Y.en_US
dc.contributor.authorTsou, B. C.en_US
dc.contributor.authorHuang, G. W.en_US
dc.date.accessioned2014-12-08T15:25:29Z-
dc.date.available2014-12-08T15:25:29Z-
dc.date.issued2005en_US
dc.identifier.isbn88-902012-0-7en_US
dc.identifier.urihttp://hdl.handle.net/11536/17884-
dc.description.abstractA selectively ion-implanted collector (SIC) is implemented in a 0.8 um BiCMOS process to improve the RF characteristics of the BJT devices. The SIC BJT device has better ft and fmax than the FIC (fully ion-implanted collector) BJT device because the extrinsic base-collector capacitance is reduced by the SIC process. The fmax is 9.5GHz and ft is 7.8 GHz for the SIC BJT device while the fmax is 7.2 GHz and fmax is 4.5 GHz for the FIC BJT device when biased at Vce=3.6 V and Jc=0.09 mA/um(2). The nois parameters are the same for both BJT devices but the associated gain is higher for the SIC BJT device.en_US
dc.language.isoen_USen_US
dc.titleRF characteristics of BJT devices with selectively or fully ion-implanted collectoren_US
dc.typeProceedings Paperen_US
dc.identifier.journalGAAS 2005: 13th European Gallium Arsenide and Other Compound Semiconductors Application Symposium, Conference Proceedingsen_US
dc.citation.spage161en_US
dc.citation.epage164en_US
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.identifier.wosnumberWOS:000238139100037-
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