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dc.contributor.authorJou, SJen_US
dc.contributor.authorLin, CHen_US
dc.contributor.authorChen, CNen_US
dc.contributor.authorWang, YJen_US
dc.contributor.authorHsiao, JYen_US
dc.date.accessioned2014-12-08T15:25:35Z-
dc.date.available2014-12-08T15:25:35Z-
dc.date.issued2005en_US
dc.identifier.isbn0-7803-9328-7en_US
dc.identifier.urihttp://hdl.handle.net/11536/17984-
dc.description.abstractMulti-Gbps serial link transmitter for both off-chip and on-chip transmission are presented. For off-chip transmission, a new pre-emphasis design methodology and circuits for a 4/2 PAM transmitter over cable are proposed. A test chip of transmitter with pre-emphasis, PLL circuit and on-chip termination resistors is implemented using tsmc 0.18 urn CMOS process. The measurement results of 1015 Gbps (4/2 PAM) are carried out over 5 meter (m) long cable and is in agreement with our analysis and simulation results. For on-chip transmission, SerDes based serial link architecture is used in on-chip application. Using tsmc 0.13 um CMOS process, the operation speed and power consumption are 5 Gbps and 3.2 mW respectively with the interconnect area is half of parallel architecture.en_US
dc.language.isoen_USen_US
dc.titleMulti-gigabit serial link transmitter- off-chip and on-chipen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2005 Emerging Information Technology Conference (EITC)en_US
dc.citation.spage45en_US
dc.citation.epage48en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000236376100013-
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