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dc.contributor.authorLin, HCen_US
dc.contributor.authorYeh, KLen_US
dc.contributor.authorLee, MHen_US
dc.contributor.authorSu, YCen_US
dc.contributor.authorHuang, TYen_US
dc.contributor.authorShen, SWen_US
dc.contributor.authorLin, HYen_US
dc.date.accessioned2014-12-08T15:25:43Z-
dc.date.available2014-12-08T15:25:43Z-
dc.date.issued2004en_US
dc.identifier.isbn0-7803-8684-1en_US
dc.identifier.urihttp://hdl.handle.net/11536/18126-
dc.identifier.urihttp://dx.doi.org/10.1109/IEDM.2004.1419290en_US
dc.description.abstractA novel methodology that greatly simplifies the procedure of extracting the effective density-of-states (DOS) in polycrystalline-Si thin-film transistors (poly-Si TFTs) is proposed and demonstrated. The characterization is performed on a Schottky barrier (SB) TFT with electrical source/drain extensions induced by a field-plate. Only one single device and two simple subthreshold I-V measurements at room temperature are needed for full band-gap DOS extraction. Impacts of different process treatments are clearly resolved using this methodology.en_US
dc.language.isoen_USen_US
dc.titleA novel methodology for extracting effective density-of-states in poly-Si thin-film transistorsen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1109/IEDM.2004.1419290en_US
dc.identifier.journalIEEE INTERNATIONAL ELECTRON DEVICES MEETING 2004, TECHNICAL DIGESTen_US
dc.citation.spage781en_US
dc.citation.epage784en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000227158500180-
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