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dc.contributor.authorCheng, CCen_US
dc.contributor.authorWu, JWen_US
dc.contributor.authorLee, CCen_US
dc.contributor.authorShao, JHen_US
dc.contributor.authorWang, Ten_US
dc.date.accessioned2014-12-08T15:25:51Z-
dc.date.available2014-12-08T15:25:51Z-
dc.date.issued2004en_US
dc.identifier.isbn0-7803-8454-7en_US
dc.identifier.urihttp://hdl.handle.net/11536/18280-
dc.description.abstractThe hot carrier performance of N-LDMOS and P-LDMOS transistors is evaluated. For N-LDMOS transistors, the drain current degradation is shown to be due to hot electron injection in the drift region field oxide (bird's beak edge). On the other hand, the hot carrier-damaged region of P-LDMOS transistors is within the channel region, and hot electron is also the source of degradation.en_US
dc.language.isoen_USen_US
dc.subjecthot carrieren_US
dc.subjectLDMOSen_US
dc.subjectpower deviceen_US
dc.subjectimpact ionizationen_US
dc.titleHot carrier degradation in LDMOS power transistorsen_US
dc.typeProceedings Paperen_US
dc.identifier.journalIPFA 2004: PROCEEDINGS OF THE 11TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITSen_US
dc.citation.spage283en_US
dc.citation.epage286en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000224428800069-
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