Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Tai, WC | en_US |
dc.contributor.author | Wu, CT | en_US |
dc.contributor.author | Hsu, CP | en_US |
dc.contributor.author | Hsu, W | en_US |
dc.date.accessioned | 2014-12-08T15:25:52Z | - |
dc.date.available | 2014-12-08T15:25:52Z | - |
dc.date.issued | 2004 | en_US |
dc.identifier.isbn | 0-7803-8265-X | en_US |
dc.identifier.issn | 1084-6999 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/18289 | - |
dc.description.abstract | Here a three-dimensional micoractuator is proposed by integrating an electro-thermal long stretch micro drive (LSMD) and mechanical hinge mechanism. The mechanical hinge is used to allow the LSMD to be lifted. One of the important issues in fabricating the lifted microactuator is the conducting circuit to actuate the microactuator. Here the electroplating process is used to fabricate the mechanical hinge structure and the LSMD, and then the mechanical hinge itself can act as the conductive circuit easily. The fabrication and testing result show that the three-dimensional LSMD of 2000 mum wide and 500 mum high can stand vertically with output displacement up to 56 mum at input voltage of 2 volts. However, it is found that the output displacement of three-dimensional LSMD is smaller than planar LSMD with substrate beneath due to the lacking of heat conduction at the same input voltage. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Tdesign and fabrication of a three-dimensional long-stretch micro drive by electroplating | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | MEMS 2004: 17TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | en_US |
dc.citation.spage | 474 | en_US |
dc.citation.epage | 477 | en_US |
dc.contributor.department | 機械工程學系 | zh_TW |
dc.contributor.department | Department of Mechanical Engineering | en_US |
dc.identifier.wosnumber | WOS:000189435200118 | - |
Appears in Collections: | Conferences Paper |