完整後設資料紀錄
DC 欄位語言
dc.contributor.authorYEH, CFen_US
dc.contributor.authorLIN, SSen_US
dc.date.accessioned2014-12-08T15:03:16Z-
dc.date.available2014-12-08T15:03:16Z-
dc.date.issued1995-07-01en_US
dc.identifier.issn0022-3093en_US
dc.identifier.urihttp://dx.doi.org/10.1016/0022-3093(95)00116-6en_US
dc.identifier.urihttp://hdl.handle.net/11536/1829-
dc.description.abstractEffects of plasma treatment including H-2 or O-2 On the properties of LPD oxide were investigated. After plasma treatment, the physicochemical characteristics of LPD oxide films were greatly improved. No matter whether with H-2 or O-2 plasma treatment, the LPD oxide film exhibited higher refractive index and lower P-etch rate than as-deposited films. The electrical characteristics were also improved. This indicates that plasma treatment can effectively passivate the vacancies in LPD oxide. It was also found that the treatment using O-2 source was better than using H-2. This was the same as for the case of thermal annealing. Because the plasma treated LPD oxide exhibited superior results to the thermally annealed one and the temperature in plasma treatment was much lower than that in thermal annealing, plasma treatment is more suitable for improving the characteristics of LPD oxide films.en_US
dc.language.isoen_USen_US
dc.titleEFFECTS OF PLASMA TREATMENT ON THE PROPERTIES OF ROOM-TEMPERATURE LIQUID-PHASE DEPOSITED (LPD) OXIDE-FILMSen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/0022-3093(95)00116-6en_US
dc.identifier.journalJOURNAL OF NON-CRYSTALLINE SOLIDSen_US
dc.citation.volume187en_US
dc.citation.issueen_US
dc.citation.spage81en_US
dc.citation.epage85en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1995RK19500014-
dc.citation.woscount6-
顯示於類別:期刊論文


文件中的檔案:

  1. A1995RK19500014.pdf

若為 zip 檔案,請下載檔案解壓縮後,用瀏覽器開啟資料夾中的 index.html 瀏覽全文。