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dc.contributor.authorYeh, KLen_US
dc.contributor.authorLin, HCen_US
dc.contributor.authorTsai, RWen_US
dc.contributor.authorLee, MHen_US
dc.contributor.authorHuang, TYen_US
dc.date.accessioned2014-12-08T15:26:17Z-
dc.date.available2014-12-08T15:26:17Z-
dc.date.issued2003en_US
dc.identifier.isbn1-56677-385-7en_US
dc.identifier.urihttp://hdl.handle.net/11536/18667-
dc.description.abstractPoly-Si Schottky barrier poly-Si thin-film transistors (SB TFT) with field-induced drain (FID) have recently been demonstrated. Such devices exhibit ambipolar operation capability with low off-state leakage current. In this study, we investigate and compare the characteristics of poly-Si SB TFTs with channel layer prepared by either excimer laser crystallization (ELC) or solid-phase crystallization (SPC) method. It is shown that the use of ELC could greatly improve the device characteristics compared to the SPC counterparts. Excellent device performance in terms of steep subthreshold slope and high on/off current ratio (>10(8)) for both p- and n-channel operations are demonstrated on a single device with ELC channel. The effects of sub-gate bias, channel length, and offset channel length, on device characteristics are also explored.en_US
dc.language.isoen_USen_US
dc.titleCharacteristics of Schottky barrier poly-Si thin film transistors with excimer laser annealing treatmenten_US
dc.typeProceedings Paperen_US
dc.identifier.journalTHIN FILM TRANSISTOR TECHNOLOGIES VI, PROCEEDINGSen_US
dc.citation.volume2002en_US
dc.citation.issue23en_US
dc.citation.spage231en_US
dc.citation.epage237en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000186760700026-
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