完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Yeh, KL | en_US |
dc.contributor.author | Lin, HC | en_US |
dc.contributor.author | Tsai, RW | en_US |
dc.contributor.author | Lee, MH | en_US |
dc.contributor.author | Huang, TY | en_US |
dc.date.accessioned | 2014-12-08T15:26:17Z | - |
dc.date.available | 2014-12-08T15:26:17Z | - |
dc.date.issued | 2003 | en_US |
dc.identifier.isbn | 1-56677-385-7 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/18667 | - |
dc.description.abstract | Poly-Si Schottky barrier poly-Si thin-film transistors (SB TFT) with field-induced drain (FID) have recently been demonstrated. Such devices exhibit ambipolar operation capability with low off-state leakage current. In this study, we investigate and compare the characteristics of poly-Si SB TFTs with channel layer prepared by either excimer laser crystallization (ELC) or solid-phase crystallization (SPC) method. It is shown that the use of ELC could greatly improve the device characteristics compared to the SPC counterparts. Excellent device performance in terms of steep subthreshold slope and high on/off current ratio (>10(8)) for both p- and n-channel operations are demonstrated on a single device with ELC channel. The effects of sub-gate bias, channel length, and offset channel length, on device characteristics are also explored. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Characteristics of Schottky barrier poly-Si thin film transistors with excimer laser annealing treatment | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | THIN FILM TRANSISTOR TECHNOLOGIES VI, PROCEEDINGS | en_US |
dc.citation.volume | 2002 | en_US |
dc.citation.issue | 23 | en_US |
dc.citation.spage | 231 | en_US |
dc.citation.epage | 237 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000186760700026 | - |
顯示於類別: | 會議論文 |