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dc.contributor.authorChung, Steve S.en_US
dc.date.accessioned2014-12-08T15:03:20Z-
dc.date.available2014-12-08T15:03:20Z-
dc.date.issued2008en_US
dc.identifier.isbn978-1-4244-2185-5en_US
dc.identifier.urihttp://hdl.handle.net/11536/1874-
dc.identifier.urihttp://dx.doi.org/10.1109/ICSICT.2008.4734481en_US
dc.description.abstractIn this talk, an overview of the mobility enhancing techniques for high performance/low power CMOS technologies will be introduced first. Three categories of mobility enhancing schemes with global strain, local strain, and hybrid-substrate engineering, will be discussed next. Either nMOSET or pMOSFET has their respective strategies for achieving the best device performance. However, the strain technique has indeed raised reliability issues. Different reliability issues have been observed for different strain technologies. In the past several years, we have paid much more attention on the current performance of these technologies, the device reliability study has not been sufficient in the previous studies. As a consequence, this talk will also address the importance of these mobility enhancing schemes and their impact on the device reliability for advanced CMOS technologies which utilize strain schemes for current enhancement.en_US
dc.language.isoen_USen_US
dc.titleThe State-of-the-Art Mobility Enhancing Schemes for High-Performance Logic CMOS Technologiesen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1109/ICSICT.2008.4734481en_US
dc.identifier.journal2008 9TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED-CIRCUIT TECHNOLOGY, VOLS 1-4en_US
dc.citation.spage100en_US
dc.citation.epage104en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000265971000027-
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