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dc.contributor.authorSU, HPen_US
dc.contributor.authorLIU, HWen_US
dc.contributor.authorWANG, PWen_US
dc.contributor.authorCHENG, PWen_US
dc.contributor.authorJEN, IMen_US
dc.contributor.authorHONG, Gen_US
dc.contributor.authorCHENG, HCen_US
dc.date.accessioned2014-12-08T15:03:21Z-
dc.date.available2014-12-08T15:03:21Z-
dc.date.issued1995-06-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/55.790725en_US
dc.identifier.urihttp://hdl.handle.net/11536/1888-
dc.description.abstractA novel dielectric fabricated dy thermal oxidation of ultrathin rugged polysilicon film is proposed for nonvolatile memories, Different roughness degrees for the top and bottom interfaces of this dielectric ate detected by the atomic-force-microscopy (AFM) and high resolution transmission electron microscopy (HRTEM), Due to the microtips formed at the bottom interface of the dielectric, significant improvements in the high conduction efficiency, low trapping rate, good uniformity, and high reliability under positive gate-bias are obtained for the dielectric. Therefore, rugged polyoxide is promising for future 5-V-only floating-gate applications.en_US
dc.language.isoen_USen_US
dc.titleNOVEL TUNNELING DIELECTRIC PREPARED BY OXIDATION OF ULTRATHIN RUGGED POLYSILICON FOR 5-V-ONLY NONVOLATILE MEMORIESen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/55.790725en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume16en_US
dc.citation.issue6en_US
dc.citation.spage250en_US
dc.citation.epage252en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1995RA18200013-
dc.citation.woscount3-
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