Scrap rules for small lots in wafer fabrication

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Wu, MC	en_US
dc.contributor.author	Chiou, CW	en_US
dc.contributor.author	Hsu, HM	en_US
dc.date.accessioned	2014-12-08T15:26:38Z	-
dc.date.available	2014-12-08T15:26:38Z	-
dc.date.issued	2002	en_US
dc.identifier.isbn	0-7803-7604-8	en_US
dc.identifier.uri	http://hdl.handle.net/11536/18933	-
dc.description.abstract	This paper presents a genetic algorithm for determining the-rules for scrapping small lots in a semiconductor fab. Small lots are lots which carry less than 25 wafers due to yield problem. Simulation results show that the proposed approach can increase contribution margin up to 24% in the case of low yield and high average, selling price.	en_US
dc.language.iso	en_US	en_US
dc.title	Scrap rules for small lots in wafer fabrication	en_US
dc.type	Proceedings Paper	en_US
dc.identifier.journal	2002 SEMICONDUCTOR MANUFACTURING TECHNOLOGY WORKSHOP	en_US
dc.citation.spage	187	en_US
dc.citation.epage	190	en_US
dc.contributor.department	工業工程與管理學系	zh_TW
dc.contributor.department	Department of Industrial Engineering and Management	en_US
dc.identifier.wosnumber	WOS:000182423700032	-
顯示於類別：	會議論文