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dc.contributor.authorLIN, YHen_US
dc.contributor.authorLAI, SCen_US
dc.contributor.authorLEE, CLen_US
dc.contributor.authorLEI, TFen_US
dc.contributor.authorCHAO, TSen_US
dc.date.accessioned2014-12-08T15:03:22Z-
dc.date.available2014-12-08T15:03:22Z-
dc.date.issued1995-06-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/55.790724en_US
dc.identifier.urihttp://hdl.handle.net/11536/1904-
dc.description.abstractNitridation to create nitrogen-rich layers in-between the stacked layers of the poly-Si gate to suppress the boron penetration for pMOS with the gate BF (+)(2)-implantation is proposed and demonstrated, The MOS capacitors fabricated by using this nitridized stacked poly-Si gate have better thermal stability and much improved electrical characteristics.en_US
dc.language.isoen_USen_US
dc.titleNITRIDATION OF THE STACKED POLY-SI GATE TO SUPPRESS THE BORON PENETRATION IN PMOSen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/55.790724en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume16en_US
dc.citation.issue6en_US
dc.citation.spage248en_US
dc.citation.epage249en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1995RA18200012-
dc.citation.woscount8-
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