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dc.contributor.authorWu, YHen_US
dc.contributor.authorChin, Aen_US
dc.contributor.authorShih, KHen_US
dc.contributor.authorWu, CCen_US
dc.contributor.authorLiao, CPen_US
dc.contributor.authorPai, SCen_US
dc.contributor.authorChi, CCen_US
dc.date.accessioned2014-12-08T15:27:03Z-
dc.date.available2014-12-08T15:27:03Z-
dc.date.issued2000en_US
dc.identifier.isbn0-7803-5687-Xen_US
dc.identifier.issn0149-645Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/19265-
dc.description.abstractWe have achieved 1.6M Omega -cm resistivity using ion implantation that has little negative effect on MOS devices. Extremely low loss and cross coupling of 6.3 and -79 dB/cm (10 mum gap) at 20GHz are measured with 1 mum Al, respectively, which is due to implant induced trap with similar to 1ps carrier lifetime and stable to 400 degreesC.en_US
dc.language.isoen_USen_US
dc.titleRf loss and cross talk on extremely high resistivity (10K-1M Omega-cm) Si fabricated by ion implantationen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2000 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3en_US
dc.citation.spage221en_US
dc.citation.epage224en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000166811000050-
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