完整後設資料紀錄
DC 欄位語言
dc.contributor.authorTseng, WDen_US
dc.contributor.authorWang, KCen_US
dc.date.accessioned2014-12-08T15:27:28Z-
dc.date.available2014-12-08T15:27:28Z-
dc.date.issued1997en_US
dc.identifier.isbn0-8186-8213-2en_US
dc.identifier.urihttp://hdl.handle.net/11536/19729-
dc.description.abstractThis paper proposes a simple and efficient model for designers to estimate fault coverage for partially testable MCMs. This model relates fault coverage, test methodology, and the ratio and distribution of DFT dies (dies with design for testability features) in an MCM. Experimental results show that our model can efficiently predict the fault coverage of a partially testable MCM with less than 5% deviation. In addition, the upper bound far fault coverage is also analyzed to guide the designers to know when to stop the effort in planning the use of DFT dies. Two defect level estimation models which relate fault coverage and manufacturing yield for measuring the test quality of MCMs under equiprobable and nonequiprobable faults, respectively, are also presented and evaluated.en_US
dc.language.isoen_USen_US
dc.titleFault coverage estimation model for partially testable multichip modulesen_US
dc.typeProceedings Paperen_US
dc.identifier.journalPACIFIC RIM INTERNATIONAL SYMPOSIUM ON FAULT-TOLERANT SYSTEMS, PROCEEDINGSen_US
dc.citation.spage72en_US
dc.citation.epage77en_US
dc.contributor.department資訊工程學系zh_TW
dc.contributor.departmentDepartment of Computer Scienceen_US
dc.identifier.wosnumberWOS:000071431900012-
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