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dc.contributor.authorCHAO, TSen_US
dc.contributor.authorLEI, TFen_US
dc.date.accessioned2014-12-08T15:03:30Z-
dc.date.available2014-12-08T15:03:30Z-
dc.date.issued1995-03-01en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://dx.doi.org/10.1149/1.2048576en_US
dc.identifier.urihttp://hdl.handle.net/11536/2027-
dc.description.abstractGrowth mechanisms of three different orientations Si wafer oxidized in N2O have been investigated in this study. A thickness crossover phenomenon in oxidation rates was found for orientations (110) and (111) at a critical oxide thickness 150 Angstrom. From our results, this phenomenon is closely related with the initial native oxide before oxidation.en_US
dc.language.isoen_USen_US
dc.titleCROSSOVER PHENOMENON IN OXIDATION RATES OF THE (110) AND (111) ORIENTATIONS OF SILICON IN N2Oen_US
dc.typeLetteren_US
dc.identifier.doi10.1149/1.2048576en_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume142en_US
dc.citation.issue3en_US
dc.citation.spageL34en_US
dc.citation.epageL35en_US
dc.contributor.department電控工程研究所zh_TW
dc.contributor.departmentInstitute of Electrical and Control Engineeringen_US
dc.identifier.wosnumberWOS:A1995QL58500002-
dc.citation.woscount1-
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