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dc.contributor.authorTsai, Tsung-Mingen_US
dc.contributor.authorChang, Kuan-Changen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorSyu, Yong-Enen_US
dc.contributor.authorLiao, Kuo-Hsiaoen_US
dc.contributor.authorTseng, Bae-Hengen_US
dc.contributor.authorSze, Simon M.en_US
dc.date.accessioned2014-12-08T15:28:19Z-
dc.date.available2014-12-08T15:28:19Z-
dc.date.issued2012-09-10en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.4750235en_US
dc.identifier.urihttp://hdl.handle.net/11536/20478-
dc.description.abstractThe tin-doped can supply conduction path to induce resistance switching behavior. However, the defect of tin-doped silicon oxide (Sn:SiOx) increased the extra leakage path lead to power consumption and joule heating degradation. In the study, supercritical CO2 fluids treatment was used to improve resistive switching property. The current conduction of high resistant state in post-treated Sn:SiOx film was transferred to Schottky emission from Frenkel-Poole due to the passivation effect. The molecular reaction model is proposed that the defect was passivated through dehydroxyl effect of supercritical fluid technology, verified by material analyses of x-ray photoelectron spectroscopy and Fourier transform infrared spectroscopy. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4750235]en_US
dc.language.isoen_USen_US
dc.titleDehydroxyl effect of Sn-doped silicon oxide resistance random access memory with supercritical CO2 fluid treatmenten_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.4750235en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume101en_US
dc.citation.issue11en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.department腦科學研究中心zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentBrain Research Centeren_US
dc.identifier.wosnumberWOS:000309329300057-
dc.citation.woscount16-
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