標題: Electrical Performances and Quality Investigations of Integrated Bonded Structures and TSVs for 3D Interconnects
作者: Chen, K. N.
Chang, Y. J.
Ko, C. T.
Hsu, S. Y.
Chen, H. Y.
Hsiao, C.
Yu, T. H.
Chen, Y. H.
Lo, W. C.
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 2012
URI: http://hdl.handle.net/11536/20752
ISBN: 978-1-4673-1137-3
期刊: 2012 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC)
Appears in Collections:Conferences Paper