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dc.contributor.authorLIN, YHen_US
dc.contributor.authorLEE, CLen_US
dc.contributor.authorLEI, TFen_US
dc.contributor.authorCHAO, TSen_US
dc.date.accessioned2014-12-08T15:03:33Z-
dc.date.available2014-12-08T15:03:33Z-
dc.date.issued1995-02-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.1143/JJAP.34.752en_US
dc.identifier.urihttp://hdl.handle.net/11536/2088-
dc.description.abstractA new stacked poly-Si gate structure with a thin (similar to 20 Angstrom) oxide inserted in-between for p-channel metal-oxide semiconductor feild effect transistor (pMOSFET) application is proposed and demonstrated. Due to the gettering flourine effect of this thin oxide for BF2+-implanted poly-Si gate, the amount of fluorine in the gate oxide, consequently, the boron penetration enhanced by fluorine are reduced. The thicker or the more apart from the gate oxide of this gettering fluorine oxide is, the more effectively it can suppress the boron penetration. Moreover, this new structure improves more the electrical characteristics than the conventional and the stacked layer poly silicon gate structures.en_US
dc.language.isoen_USen_US
dc.subjectPMOSen_US
dc.subjectSTACKED POLY-SI GATEen_US
dc.subjectBF2+ IMPLANTATIONen_US
dc.subjectOXIDE GETTERING FLUORINE EFFECTen_US
dc.subjectBORON PENETRATIONen_US
dc.titleSUPPRESSION OF BORON PENETRATION IN PMOS BY USING BRIDE GETTERING EFFECT IN POLY-SI GATEen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1143/JJAP.34.752en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERSen_US
dc.citation.volume34en_US
dc.citation.issue2Ben_US
dc.citation.spage752en_US
dc.citation.epage756en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1995RF65900014-
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