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dc.contributor.authorHsu, Ching-Huien_US
dc.contributor.authorFan, Yang-Shunen_US
dc.contributor.authorLiu, Po-Tsunen_US
dc.date.accessioned2014-12-08T15:29:30Z-
dc.date.available2014-12-08T15:29:30Z-
dc.date.issued2013-02-11en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.4792316en_US
dc.identifier.urihttp://hdl.handle.net/11536/21219-
dc.description.abstractMulti-level storage capability of resistive random access memory (RRAM) using amorphous indium-gallium-zinc-oxide (InGaZnO) thin film is demonstrated by the TiN/Ti/InGaZnO/Pt device structure under different operation modes. The distinct four-level resistance states can be obtained by varying either the trigger voltage pulse or the compliance current. In addition, the RRAM devices exhibit superior characteristics of programming/erasing endurance and data retention for the application of multi-level nonvolatile memory technology. Physical transport mechanisms for the multi-level resistive switching characteristics are also deduced in this study. (C) 2013 American Institute of Physics. [http://dx.doi.org/10.1063/1.4792316]en_US
dc.language.isoen_USen_US
dc.titleMultilevel resistive switching memory with amorphous InGaZnO-based thin filmen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.4792316en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume102en_US
dc.citation.issue6en_US
dc.citation.epageen_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.department顯示科技研究所zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.contributor.departmentInstitute of Displayen_US
dc.identifier.wosnumberWOS:000315053300067-
dc.citation.woscount10-
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