完整後設資料紀錄
DC 欄位語言
dc.contributor.authorYu, Chia-Huien_US
dc.contributor.authorHsu, Heng-Tungen_US
dc.contributor.authorChiang, Che-Yangen_US
dc.contributor.authorKuo, Chien-Ien_US
dc.contributor.authorMiyamoto, Yasuyukien_US
dc.contributor.authorChang, Edward Yien_US
dc.date.accessioned2014-12-08T15:29:32Z-
dc.date.available2014-12-08T15:29:32Z-
dc.date.issued2013-02-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.7567/JJAP.52.020203en_US
dc.identifier.urihttp://hdl.handle.net/11536/21237-
dc.description.abstractIn this study, we present the fabrication and characterization of InGaSb/AlSb p-channel high-hole-mobility-transistor devices using inductively coupled plasma (ICP) etching with BCl3 gas. Devices fabricated by the dry etching technique show good DC and RF performances. Radio-frequency (RF) performance for devices with different source-to-drain spacing (L-SD) and gate length (L-g) were investigated. The fabricated 80-nm-gate-length p-channel device with 2-mu m LSD exhibited a maximum drain current of 86.2mA/mm with peak transconductance (g(m)) of 64.5mS/mm. The current gain cutoff frequency (f(T)) was measured to be 15.8 GHz when the device was biased at V-DS = -1.2 V and V-GS = 0.4 V. (C) 2013 The Japan Society of Applied Physicsen_US
dc.language.isoen_USen_US
dc.titlePerformance Evaluation of InGaSb/AlSb P-Channel High-Hole-Mobility Transistor Faricated Using BCl3 Dry Etchingen_US
dc.typeArticleen_US
dc.identifier.doi10.7567/JJAP.52.020203en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume52en_US
dc.citation.issue2en_US
dc.citation.epageen_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000314466800003-
dc.citation.woscount1-
顯示於類別:期刊論文


文件中的檔案:

  1. 000314466800003.pdf

若為 zip 檔案,請下載檔案解壓縮後,用瀏覽器開啟資料夾中的 index.html 瀏覽全文。