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dc.contributor.authorChang, Edward-Yien_US
dc.contributor.authorKuo, Chien-Ien_US
dc.contributor.authorHsu, Heng-Tungen_US
dc.contributor.authorChiang, Che-Yangen_US
dc.contributor.authorMiyamoto, Yasuyukien_US
dc.date.accessioned2014-12-08T15:29:52Z-
dc.date.available2014-12-08T15:29:52Z-
dc.date.issued2013-03-01en_US
dc.identifier.issn1882-0778en_US
dc.identifier.urihttp://dx.doi.org/10.7567/APEX.6.034001en_US
dc.identifier.urihttp://hdl.handle.net/11536/21413-
dc.description.abstract60 nm InAs high-electron-mobility transistors (HEMTs) with a thin channel, a thin InAlAs barrier layer, and a very high gate stem structure have been fabricated and characterized. The thickness of the channel, as well as that of the InAlAs barrier layer, was reduced to 5 nm. A stem height of 250 nm with a Pt-buried gate was used in the device configuration to reduce the parasitics. A high DC transconductance of 2114 mS/mm and a current-gain cutoff frequency (f(T)) of 710 GHz were achieved at V-DS 0.5V. (C) 2013 The Japan Society of Applied Physicsen_US
dc.language.isoen_USen_US
dc.titleInAs Thin-Channel High-Electron-Mobility Transistors with Very High Current-Gain Cutoff Frequency for Emerging Submillimeter-Wave Applicationsen_US
dc.typeArticleen_US
dc.identifier.doi10.7567/APEX.6.034001en_US
dc.identifier.journalAPPLIED PHYSICS EXPRESSen_US
dc.citation.volume6en_US
dc.citation.issue3en_US
dc.citation.epageen_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000315938100019-
dc.citation.woscount5-
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