Title: | Charge Quantity Influence on Resistance Switching Characteristic During Forming Process |
Authors: | Chu, Tian-Jian Chang, Ting-Chang Tsai, Tsung-Ming Wu, Hsing-Hua Chen, Jung-Hui Chang, Kuan-Chang Young, Tai-Fa Chen, Kai-Hsang Syu, Yong-En Chang, Geng-Wei Chang, Yao-Feng Chen, Min-Chen Lou, Jyun-Hao Pan, Jhih-Hong Chen, Jian-Yu Tai, Ya-Hsiang Ye, Cong Wang, Hao Sze, Simon M. 電子工程學系及電子研究所 光電工程學系 Department of Electronics Engineering and Institute of Electronics Department of Photonics |
Keywords: | Forming process;hafnium oxide (HfO2);nonvolatile memory;resistance switching |
Issue Date: | 1-Apr-2013 |
Abstract: | In this letter, we presented that the charge quantity is the critical factor for forming process. Forming is a pivotal process in resistance random access memory to activate the resistance switching behavior. However, overforming would lead to device damage. In general, the overshoot current has been considered as a degradation reason during the forming process. In this letter, the quantity of charge through the switching layer has been proven as the key element in the formation of the conduction path. Ultrafast pulse forming can form a discontinuous conduction path to reduce the operation power. |
URI: | http://dx.doi.org/10.1109/LED.2013.2242843 http://hdl.handle.net/11536/21712 |
ISSN: | 0741-3106 |
DOI: | 10.1109/LED.2013.2242843 |
Journal: | IEEE ELECTRON DEVICE LETTERS |
Volume: | 34 |
Issue: | 4 |
Begin Page: | 502 |
End Page: | 504 |
Appears in Collections: | Articles |
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