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dc.contributor.authorWu, Hung-Chien_US
dc.contributor.authorLin, Bi-Hsuanen_US
dc.contributor.authorChen, Huang-Chinen_US
dc.contributor.authorChen, Po-Chinen_US
dc.contributor.authorSheu, Hwo-Shuennen_US
dc.contributor.authorLin, I-Nanen_US
dc.contributor.authorChiu, Hsin-Tienen_US
dc.contributor.authorLee, Chi-Youngen_US
dc.date.accessioned2014-12-08T15:30:33Z-
dc.date.available2014-12-08T15:30:33Z-
dc.date.issued2011-07-01en_US
dc.identifier.issn1944-8244en_US
dc.identifier.urihttp://dx.doi.org/10.1021/am200310cen_US
dc.identifier.urihttp://hdl.handle.net/11536/21836-
dc.description.abstractFabricating a low-cost virtual germanium (Ge) template by epitaxial growth of Ge films on silicon wafer with a Ge(x)Si(1-x) (0 < x < 1) graded buffer layer was demonstrated through a facile chemical vapor deposition method in one step by decomposing a hazardousless GeO(2) powder under hydrogen atmosphere without ultra-high vacuum condition and then depositing in a low-temperature region. X-ray diffraction analysis shows that the Ge film with an epitaxial relationship is along the in-plane direction of Si. The successful growth of epitaxial Ge films on Si substrate demonstrates the feasibility of integrating various functional devices on the Ge/Si substrates.en_US
dc.language.isoen_USen_US
dc.subjectgermanium (Ge)en_US
dc.subjectsilicon (Si)en_US
dc.subjectepitaxial growthen_US
dc.subjectchemical vapor deposition (CVD)en_US
dc.subjectone-step growthen_US
dc.titleOne-Step Ge/Si Epitaxial Growthen_US
dc.typeArticleen_US
dc.identifier.doi10.1021/am200310cen_US
dc.identifier.journalACS APPLIED MATERIALS & INTERFACESen_US
dc.citation.volume3en_US
dc.citation.issue7en_US
dc.citation.spage2398en_US
dc.citation.epage2401en_US
dc.contributor.department應用化學系zh_TW
dc.contributor.departmentDepartment of Applied Chemistryen_US
dc.identifier.wosnumberWOS:000293196800035-
dc.citation.woscount1-
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