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dc.contributor.authorCHANG, CYen_US
dc.contributor.authorLIN, CYen_US
dc.contributor.authorCHOU, JWen_US
dc.contributor.authorHSU, CCHen_US
dc.contributor.authorPAN, HTen_US
dc.contributor.authorKO, Jen_US
dc.date.accessioned2014-12-08T15:03:44Z-
dc.date.available2014-12-08T15:03:44Z-
dc.date.issued1994-11-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/55.334659en_US
dc.identifier.urihttp://hdl.handle.net/11536/2277-
dc.description.abstractThe boron-penetration-dependent Reverse Short Channel Effect (RSCE) on the threshold voltage is observed for short channel p+ poly-gate PMOSFET's. The RSCE is found to be more significant as the boron penetration becomes more severe. The RSCE is significant in BF2 doped poly-gated MOS devices and is alleviated in buffered poly-gated MOS devices. Fluorine enhanced boron diffusion in the gate oxide during high temperature process is believed to account for the RSCE, which is also confirmed by using a two-dimensional process simulator.en_US
dc.language.isoen_USen_US
dc.titleANOMALOUS REVERSE SHORT-CHANNEL EFFECT IN P+ POLYSILICON GATED P-CHANNEL MOSFETen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/55.334659en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume15en_US
dc.citation.issue11en_US
dc.citation.spage437en_US
dc.citation.epage439en_US
dc.contributor.department電控工程研究所zh_TW
dc.contributor.department奈米中心zh_TW
dc.contributor.departmentInstitute of Electrical and Control Engineeringen_US
dc.contributor.departmentNano Facility Centeren_US
dc.identifier.wosnumberWOS:A1994PT32600001-
dc.citation.woscount12-
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