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dc.contributor.authorLin, Je-Weien_US
dc.contributor.authorChen, Yi-Yangen_US
dc.contributor.authorGan, Jon-Yiewen_US
dc.contributor.authorHseih, Wei-Pingen_US
dc.contributor.authorDu, Chen-Hsuen_US
dc.contributor.authorChao, Tien-Shengen_US
dc.date.accessioned2014-12-08T15:32:31Z-
dc.date.available2014-12-08T15:32:31Z-
dc.date.issued2013-09-01en_US
dc.identifier.issn0741-3106en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LED.2013.2271894en_US
dc.identifier.urihttp://hdl.handle.net/11536/22786-
dc.description.abstractThis research develops high open-circuit voltage (V-OC) p-type industrial screen-printed silicon solar cells using improved rear surface passivation. It shows a significant improvement in the minority carrier lifetime by low temperature (<450 degrees C) thermal atomic layer deposition of Al2O3 layers and plasma-enhanced chemical vapor deposition of SiNx passivation layers. An increase in the V-OC and the short-circuit current (J(SC)) due to an improved long-wavelength response are also demonstrated. With the optimized stack layers, a high efficiency of 19.2% across a large area (156 cm(2)) is seen. Furthermore, the rear-side passivation scheme can be easily integrated into the conventional screen-printed process. This is very promising for in-line solar cell manufacturing.en_US
dc.language.isoen_USen_US
dc.subjectAl2O3/SiNx stack layersen_US
dc.subjectnegative fixed chargeen_US
dc.subjectopen-circuit voltageen_US
dc.subjectsurface passivationen_US
dc.titleImproved Rear-Side Passivation by Atomic Layer Deposition Al2O3/SiNx Stack Layers for High V-OC Industrial p-Type Silicon Solar Cellsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LED.2013.2271894en_US
dc.identifier.journalIEEE ELECTRON DEVICE LETTERSen_US
dc.citation.volume34en_US
dc.citation.issue9en_US
dc.citation.spage1163en_US
dc.citation.epage1165en_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:000323982500030-
dc.citation.woscount1-
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