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dc.contributor.authorHuang, Yu-Chihen_US
dc.contributor.authorChou, Chia-Hsinen_US
dc.contributor.authorLiao, Chan-Yuen_US
dc.contributor.authorTsai, Wan-Linen_US
dc.contributor.authorCheng, Huang-Chungen_US
dc.date.accessioned2014-12-08T15:33:04Z-
dc.date.available2014-12-08T15:33:04Z-
dc.date.issued2013-09-30en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.4823818en_US
dc.identifier.urihttp://hdl.handle.net/11536/23018-
dc.description.abstractProgrammable metallization cell (PMC) memory devices with oxidized Cu-Ti alloy films as the bottom electrodes have been shown to exhibit a superior on/off state current ratio (memory window) of as high as 10(3) and endurance of 3000 cycles as compared to conventional pure copper and unoxidized Cu-Ti alloy electrodes. It was conjectured that the Cu-Ti alloy electrodes could obtain the appropriate amount of copper atoms to format and rupture the conductive filaments in the resistive switching layer. Furthermore, the oxidized Cu-Ti alloys could control the Cu cations from the Cu and Cu2O to the appropriate amountto achieve the most favorable PMC characteristics. (C) 2013 AIP Publishing LLC.en_US
dc.language.isoen_USen_US
dc.titleHigh-performance resistive switching characteristics of programmable metallization cell with oxidized Cu-Ti electrodesen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.4823818en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume103en_US
dc.citation.issue14en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000325488500078-
dc.citation.woscount1-
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